Line Picking Assembly (LPA)

Automation
Sectors: Industrial
Customer: Micron SemiConductor Asia Pte Ltd

With the aid of an robotic arm, the Line Picking Assembly (LPA) is a system designed to automate the handling of Horizontal Wafer Shipper (HWS) at both the pre and post autopacker stations in a wafer fabrication plant.

Feature Highlights Manpower savings
Integrated to upstream and downstream machines for continuous automation process
Potential Applications Semi-con clean room environment robotic handling of HWSs or other clean room handling machine interface applications which are <8kg
Qualifications/Design to Tested to SEMI S22 by TUV SUD

 

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